# 顶尖应届-AI软硬融合研究工程师-芯片

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- Company: 小米 (Stage unknown)
- Locations: 上海
- Role: Engineering
- Apply on the official site: https://xiaomi.jobs.f.mioffice.cn/toptalent/position/7661961223089228059/detail

## Role description from source

1. 深入理解自研芯片架构、指令集及性能瓶颈，开展面向业务场景的芯片亲和性算法设计与优化 。
2. 结合人车家等业务场景研究并实现前沿的模型优化、量化等技术 ，并针对目标芯片进行定制化适配与验证，并形成指导下一代芯片设计的算法输入 。
3. 探索并应用AI Agent等新范式开发与优化面向自研芯片的高性能AI Infra框架、编译器、算子库及运行时系统等系统软件。
4. 参与构建从算法模型到芯片部署的完整工具链、性能分析平台与自动化优化流程 。
任职要求
1. 算法与优化能力： 对主流神经网络模型（CNN, Transformer等）有深刻理解，有模型压缩（剪枝、量化、蒸馏）、神经网络架构搜索（NAS）或轻量化网络设计等研究或实践经验。
2.芯片与AI Infra能力： 熟悉至少一种处理器架构（CPU/GPU/NPU/DSP）的微架构特性，了解并行计算模型；具备AI编译器开发（如TVM, MLIR）、算子优化（如CUDA Kernel, Triton, TileLang等，有利用AI Agent新范式研发Kernel经验者将获特别青睐 ）、AI Infra框架开发或在特定硬件上进行深度性能调优的经验。
3. 系统与部署能力： 熟悉模型推理全流程（图优化、编译优化、内存管理等），有在边缘端或车载平台部署优化复杂模型的经验者优先。
4. 核心软性特质： 具备极强的好奇心、自驱力与跨界沟通能力 ，能够主动连接算法、AI Infra、芯片等多个领域的技术专家，高效协作推动复杂问题解决。
接口顶部原始条件（未做资格推断）
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opening_id: 9eec44c2-c950-4ae5-8193-b140a1025f44

`anm openings save --id 9eec44c2-c950-4ae5-8193-b140a1025f44`